Samsung Electro-Mechanics and Qualcomm jointly developed organic bridge 2.1D packaging technology

Samsung Electro-Mechanics and Qualcomm are jointly developing organic bridge technology for 2.1D packaging, with related development and validation ongoing for over a year. The organic bridge is similar to the silicon bridge used in Intel's EMIB but is made with organic materials and produced using substrate processes to connect multiple semiconductor chips within the same package.

Samsung Electro-Mechanics embeds the organic bridge in FC-BGA substrates with grooves, connecting Qualcomm chips and evaluating performance and reliability. Qualcomm is considering using it for large multi-chip semiconductors in data centers and applied for related patents in October 2024. Samsung Electro-Mechanics is also developing this technology in parallel with several other customers.

The organic bridge aims for 5 to 7 layers of redistribution layers, with line widths and spacings of 1.5 to 2 microns, and vias of 4 to 5 microns, achieving a pattern density of 500 to 1000 per millimeter between chips. Samsung Electro-Mechanics is self-manufacturing and evaluating samples while also assessing external suppliers and collaborating with Samsung Electronics' wafer foundry for packaging evaluations.