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first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.

first_img Samsung Electronics is developing AI glasses with a display, expected to be released in the second half of 2027 at the earliest

According to the Science and Technology Innovation Board Daily, Samsung Electronics has begun developing its first AI glasses equipped with a display. This product not only provides audio functionality but also displays colorful visual information on the lenses, similar to the Meta Ray-Ban Display smart glasses.Industry insiders revealed that Samsung Electronics is considering developing an ultra-small screen with a size of only 0.2 inches or smaller for the AI glasses, and last month assigned this R&D task to Samsung Display, outlining requirements regarding product dimensions, information display area, color, and price. Samsung Electronics is currently evaluating candidate panel solutions such as OLEDoS or LEDoS, and the industry expects this product to be released in the second half of 2027 or the first half of 2028.Currently, the specific details of the glasses have not been finalized. In terms of color display, Samsung Electronics is expected to use a limited grayscale with 4-bit color instead of a high-definition screen, and it has not yet decided whether to adopt a binocular or monocular design. Industry insiders indicate that RGB OLEDoS faces challenges in terms of price and yield, and it is likely that a white OLEDoS panel will be launched. Samsung previously released AI glasses without a display, co-developed by Samsung Electronics, Google, Gentle Monster, and Warby Parker.

first_img Samsung Electro-Mechanics and LG Innotek advance Intel's EMIB-T substrate supply

According to a report by ZDNet Korea on the 9th, Samsung Electro-Mechanics and LG Innotek are advancing into the Intel EMIB-T packaging substrate supply chain, with related product development and testing already underway. EMIB connects chips with small silicon bridges, which Intel previously used mainly for its own chips; the improved EMIB-T is expanding external sales. The next-generation AI accelerator TPU that Google plans to launch in the second half of next year will be the first to use EMIB-T. EMIB-T inserts silicon vias for power transmission within the silicon bridge.Insiders say that Samsung Electro-Mechanics has developed EMIB substrate samples over the years and is currently advancing EMIB-T supply based on the 2.1D packaging substrate concept. Recently, LG Innotek delivered EMIB-T packaging substrates to SK Hynix for sample testing, and both parties are installing HBM on the substrate to evaluate product characteristics.Currently, EMIB-T packaging substrates are supplied by Japan's Ibiden, Shinkawa Electric, Taiwan's Xinxing Electronics, and Austria's AT&S. Ibiden has decided to utilize idle factories to construct a dedicated production line for Intel's EMIB-T substrates, with an investment scale of about 20 trillion Korean won, and it is reported that they have already received advance payments from Google, Amazon, Intel, and others.

first_img Licheng, Jingyuan Electronics, and Silergy experienced a double increase in revenue in August, and Licheng's panel-level packaging capacity has been fully booked

Licheng, Jingyuan Electronics, and Silergy all reported year-on-year and month-on-month revenue growth in August, with Licheng and Silergy setting new historical highs for two consecutive months. Licheng's consolidated revenue in August was 8.558 billion New Taiwan Dollars, a month-on-month increase of 3.48% and a year-on-year increase of 24.46%. After breaking the 8 billion mark for the first time in July and setting a historical high, August saw another record. The cumulative revenue for the first eight months reached 61.258 billion New Taiwan Dollars, a year-on-year increase of 30.83%. Jingyuan Electronics reported revenue of 4.08 billion New Taiwan Dollars in August, a month-on-month increase of 2.23% and a year-on-year increase of 31.58%. The cumulative revenue for the first eight months was 29.404 billion New Taiwan Dollars, a year-on-year increase of 35.53%. Silergy's revenue in August was 2.07 billion New Taiwan Dollars, with a month-on-month increase of nearly 3% and a year-on-year increase of nearly 29%. The cumulative revenue for the first eight months reached 15.26 billion New Taiwan Dollars, a year-on-year increase of over 20%.Licheng's main source of growth this year remains the rebound in demand for memory packaging and testing. Licheng previously anticipated that revenue in the third quarter would show single-digit quarter-on-quarter growth, with the fourth quarter having the potential to exceed the third quarter. The momentum for memory orders is expected to continue until the end of the year, with a positive market outlook at the beginning of next year. In addition to its core memory business, advanced packaging has become a key focus for the next phase of development. The panel-level packaging has already been adopted by American clients, and the production capacity of the P11 plant has been secured by clients, with plans to enter the mass production phase of integrated ASIC and HBM AI chips by mid-2027.Jingyuan Electronics has been actively expanding its high-end testing capacity in recent years, with AI-related products becoming an important driving force for its operations. The testing demand for AI GPUs, ASICs, and high-performance computing chips remains its main source of growth. Silergy pointed out that the demand for AI and high-speed interconnects is strong, including an increase in demand for high-performance computing chips such as CPUs, GPUs, ASICs, and AI accelerators. After completing the cleanroom construction at the newly acquired Hukou plant in February, Silergy began mass production in July, currently achieving 40% of the total capacity of the plant and gradually taking on new demand from overseas clients.

first_img ASUS and GIGABYTE have raised the prices of graphics cards in mainland China, with increases of up to 500 yuan

ASUS and Gigabyte, among other graphics card manufacturers, plan to raise product prices in the mainland Chinese market again in September, by up to 500 yuan (approximately 2,300 New Taiwan dollars). The price increase effect will also boost the performance of ASUS, Gigabyte, MSI, Leadtek, and Chengqi.According to reports from mainland Chinese media IT Home, ASUS will raise the net cost price of the NVIDIA RTX 5070 series by 150 to 300 yuan in September, while prices for other series models will remain unchanged. Gigabyte will increase the price of all models in the NVIDIA RTX 5060TI 16G series by 200 yuan in September, while other models will remain the same. AMD's RX 9070 XT series will increase by 200 yuan; the RX 9060 XT 16G/8G series will increase by 200 to 250 yuan; and the RX 7650 GRE series will increase by 400 yuan.The main reason for the price increase is the shortage of memory, and production capacity has also shifted towards manufacturing AI computing power GPUs. NVIDIA has again lowered the overall shipment volume of consumer GPUs by 15% to 20% for the third quarter, and the estimated supply for various brands in September is similar to that in August, with supply still tight. The high-end models such as the NVIDIA RTX 5080 and 5070 TI remain among the most out-of-stock models. This year, NVIDIA has raised graphics card prices multiple times, and September marks another increase.
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