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first_img Samsung Electronics is developing AI glasses with a display, expected to be released in the second half of 2027 at the earliest

According to the Science and Technology Innovation Board Daily, Samsung Electronics has begun developing its first AI glasses equipped with a display. This product not only provides audio functionality but also displays colorful visual information on the lenses, similar to the Meta Ray-Ban Display smart glasses.Industry insiders revealed that Samsung Electronics is considering developing an ultra-small screen with a size of only 0.2 inches or smaller for the AI glasses, and last month assigned this R&D task to Samsung Display, outlining requirements regarding product dimensions, information display area, color, and price. Samsung Electronics is currently evaluating candidate panel solutions such as OLEDoS or LEDoS, and the industry expects this product to be released in the second half of 2027 or the first half of 2028.Currently, the specific details of the glasses have not been finalized. In terms of color display, Samsung Electronics is expected to use a limited grayscale with 4-bit color instead of a high-definition screen, and it has not yet decided whether to adopt a binocular or monocular design. Industry insiders indicate that RGB OLEDoS faces challenges in terms of price and yield, and it is likely that a white OLEDoS panel will be launched. Samsung previously released AI glasses without a display, co-developed by Samsung Electronics, Google, Gentle Monster, and Warby Parker.

The second episode of the Gate Stocks series is now online, with Lucas Sum, the head of stock market development, interpreting the stock layout of the cryptocurrency platform

The second episode of the Gate Stocks series is now online. Lucas Sum, the head of stock market development at Gate, shared insights on why cryptocurrency exchanges are starting to venture into the stock market and analyzed the differences between Gate and traditional brokers in terms of trading experience and asset allocation methods. Lucas Sum stated that more and more digital asset users are beginning to pay attention to stock opportunities from global companies such as NVIDIA, Apple, and Tencent. Gate integrates stocks and crypto assets into the same account, allowing users to manage different types of investment assets using the same USDT balance.In terms of trading experience, Gate Stocks supports fund transfers using USDT, enabling users to participate in stock trading without waiting for traditional bank fund settlements. In addition to regular trading hours for U.S. stocks (9:30 AM - 4:00 PM ET), it also supports pre-market and after-hours trading, with fractional shares supported down to 0.01 shares. Besides stocks and ETFs, Gate also covers investment opportunities such as stock perpetual contracts, tokenized assets, Pre-IPOs, and direct IPOs. Lucas Sum emphasized that Gate is not trying to replace traditional brokers but rather to expand the possibilities of investment platforms, bringing the global stock market directly to digital asset users.

first_img SK Hynix stated that 3D DRAM development can utilize foundry processes

SK Hynix stated on the 9th that the development of the next-generation memory 3D DRAM semiconductor can utilize foundry processes. The day before, at the 2026 SK Hynix Future Forum held at the Supex Center in the Icheon campus, Vice President Kim Kyung-hoon and Son Ho-young presented the main technical directions for 3D DRAM, including the use of logic foundry processes for DRAM peripheral circuits, maximizing data bus bandwidth, and ultra-short distance transmission.3D DRAM is the next-generation DRAM that vertically stacks the originally planar storage cells to improve integration. The two stated that achieving this technology requires addressing not only design and heat dissipation issues but also challenges in fine interconnections, bonding, and process integration in the packaging field. As the boundaries between front-end and back-end packaging, foundry, and memory technology converge, collaborative optimization beyond existing fields will become more important. Son Ho-young mentioned that 3D technology is changing the technological boundaries between wafer fabs and packaging, and it is necessary to establish an optimization and new collaboration system that transcends existing fields alongside innovations in advanced packaging technology.In a related presentation, Professor Shin Chang-hwan from Korea University stated that 3D DRAM is not only about the vertical stacking of chips but also a technology that breaks the boundaries between memory and logic. As device miniaturization approaches its limits and the time and power consumption associated with data movement between systems and memory increases, the shift to 3D technology is inevitable. He proposed a 3D integrated design framework that links materials, devices, packaging, and architecture through artificial intelligence. SK Hynix President Kwon Oh-joon, in his speech, remarked that the past memory market resembled a straight road where the competition was about who could run faster, but now it resembles a constantly changing curve, making it important to grasp the speed and direction of external environmental changes and adapt flexibly in addition to internal capabilities.
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