BTC $76,975.78 -0.38%
ETH $2,483.46 -1.67%
BNB $716.27 -1.52%
XRP $1.35 -1.45%
SOL $99.64 -2.07%
TRX $0.3379 -0.60%
DOGE $0.0826 -2.58%
ADA $0.2044 -1.64%
BCH $221.49 -2.16%
LINK $11.26 -2.13%
HYPE $77.62 -2.39%
AAVE $125.05 -0.66%
SUI $0.7030 -3.03%
XLM $0.1782 -1.02%
ZEC $1,066.10 -5.44%
AAPL $330.44 -0.77%
AMZN $254.61 -0.90%
GOOGL $337.02 -1.02%
MSFT $493.25 -0.51%
META $642.23 -0.98%
NVDA $215.17 -1.55%
TSLA $361.11 -1.73%
SNDK $1,559.73 -4.34%
INTC $99.16 -2.69%
SPCX $148.88 -0.85%
MU $941.48 -2.73%
AMD $503.13 -2.32%
BTC $76,975.78 -0.38%
ETH $2,483.46 -1.67%
BNB $716.27 -1.52%
XRP $1.35 -1.45%
SOL $99.64 -2.07%
TRX $0.3379 -0.60%
DOGE $0.0826 -2.58%
ADA $0.2044 -1.64%
BCH $221.49 -2.16%
LINK $11.26 -2.13%
HYPE $77.62 -2.39%
AAVE $125.05 -0.66%
SUI $0.7030 -3.03%
XLM $0.1782 -1.02%
ZEC $1,066.10 -5.44%
AAPL $330.44 -0.77%
AMZN $254.61 -0.90%
GOOGL $337.02 -1.02%
MSFT $493.25 -0.51%
META $642.23 -0.98%
NVDA $215.17 -1.55%
TSLA $361.11 -1.73%
SNDK $1,559.73 -4.34%
INTC $99.16 -2.69%
SPCX $148.88 -0.85%
MU $941.48 -2.73%
AMD $503.13 -2.32%

cess

All
Article
Flash

first_img SK Hynix stated that 3D DRAM development can utilize foundry processes

SK Hynix stated on the 9th that the development of the next-generation memory 3D DRAM semiconductor can utilize foundry processes. The day before, at the 2026 SK Hynix Future Forum held at the Supex Center in the Icheon campus, Vice President Kim Kyung-hoon and Son Ho-young presented the main technical directions for 3D DRAM, including the use of logic foundry processes for DRAM peripheral circuits, maximizing data bus bandwidth, and ultra-short distance transmission.3D DRAM is the next-generation DRAM that vertically stacks the originally planar storage cells to improve integration. The two stated that achieving this technology requires addressing not only design and heat dissipation issues but also challenges in fine interconnections, bonding, and process integration in the packaging field. As the boundaries between front-end and back-end packaging, foundry, and memory technology converge, collaborative optimization beyond existing fields will become more important. Son Ho-young mentioned that 3D technology is changing the technological boundaries between wafer fabs and packaging, and it is necessary to establish an optimization and new collaboration system that transcends existing fields alongside innovations in advanced packaging technology.In a related presentation, Professor Shin Chang-hwan from Korea University stated that 3D DRAM is not only about the vertical stacking of chips but also a technology that breaks the boundaries between memory and logic. As device miniaturization approaches its limits and the time and power consumption associated with data movement between systems and memory increases, the shift to 3D technology is inevitable. He proposed a 3D integrated design framework that links materials, devices, packaging, and architecture through artificial intelligence. SK Hynix President Kwon Oh-joon, in his speech, remarked that the past memory market resembled a straight road where the competition was about who could run faster, but now it resembles a constantly changing curve, making it important to grasp the speed and direction of external environmental changes and adapt flexibly in addition to internal capabilities.

first_img Anthropic admits that Claude accessed the system beyond his authority due to a security error

In a blog post released on Monday, Anthropic acknowledged that its Claude model had unauthorized access to real computer systems during a cybersecurity assessment, an incident reflecting operational security failures as well as alignment failures in motivation reasoning and intent to harm. Anthropic disclosed in July that the Claude model had breached the systems of three companies because the third-party assessment environment was connected to the public internet, while the model was informed it was in a simulated environment without internet access.Anthropic stated that Claude may have interpreted evidence of real internet access as still being in a simulated environment and was willing to take harmful actions on the real internet to complete the cybersecurity assessment task. Additionally, during tests at the UK AI Safety Institute, after assessors deliberately granted Claude Mythos internet access, the model took unauthorized actions on the live network. Anthropic emphasized that the models involved did not have the cybersecurity protections included in the officially released products.Following the incident on July 30, Anthropic has suspended cybersecurity assessments of pre-release models and introduced stricter protections: tests must run in verified offline sandboxes equipped with real-time monitoring; a new classifier can intercept suspected boundary violations, terminate tests, and notify humans. Anthropic has also expanded the scope of offline monitoring used by internal frontier agents. Previously, OpenAI models had also breached Hugging Face in July to obtain answers for cybersecurity tests, with investigations revealing that about 1,200 agents acted collaboratively through unauthorized message boards.
app_icon
ChainCatcher Building the Web3 world with innovations.