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first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.

Strive's preferred stock scale approaches 1 billion USD, Gemini approved for full MPI license in Singapore

According to BBX data, global listed treasury, well-known exchanges, and cross-border clearing platforms disclosed the latest updates yesterday, with the core information as follows:Strive's preferred stock SATA approaches $1 billion, holding over 24,500 coins: The perpetual preferred stock SATA issued by Strive (NASDAQ: $ASST) has a market value nearing $1 billion. Currently, Strive's balance sheet holds a total of 24,531 Bitcoins (worth approximately $1.96 billion). Thanks to an annualized dividend yield of up to 13%, SATA demonstrates strong financing capabilities, helping the company continuously raise funds to allocate BTC. In contrast, the similar preferred stock STRC under another treasury giant Strategy has an annualized dividend yield of 12%, but its secondary market trading price has consistently underperformed its par value, failing to return to the $100 benchmark since May of this year.Gemini obtains a Major Payment Institution license from the Monetary Authority of Singapore (MAS): Cryptocurrency exchange Gemini officially announced that its Singapore entity, Gemini Digital Payments Singapore, Pte. Ltd. (GDPSPL), has successfully obtained a Major Payment Institution (MPI) license officially issued by the Monetary Authority of Singapore (MAS). After approval, Gemini will be allowed to compliantly provide digital payment tokens (DPT) and compliant cross-border remittance clearing services within Singapore, further solidifying its compliance center layout in the Asia-Pacific region.OSL Group partners with Waka to facilitate stablecoin settlements for trade corridors between Africa and the world: Hong Kong-listed stablecoin payment and trading platform OSL Group (00863.HK) announced a deep cooperation with the payment platform Waka, which connects emerging market liquidity and clearing networks. OSL will deeply integrate institutional-level infrastructure covering stablecoin to USD and USD-native payment capabilities into Waka's clearing system, focusing on empowering seamless cross-border clearing and corporate settlement needs for major trade corridors between Africa and the world.

first_img Samsung Electro-Mechanics and LG Innotek advance Intel's EMIB-T substrate supply

According to a report by ZDNet Korea on the 9th, Samsung Electro-Mechanics and LG Innotek are advancing into the Intel EMIB-T packaging substrate supply chain, with related product development and testing already underway. EMIB connects chips with small silicon bridges, which Intel previously used mainly for its own chips; the improved EMIB-T is expanding external sales. The next-generation AI accelerator TPU that Google plans to launch in the second half of next year will be the first to use EMIB-T. EMIB-T inserts silicon vias for power transmission within the silicon bridge.Insiders say that Samsung Electro-Mechanics has developed EMIB substrate samples over the years and is currently advancing EMIB-T supply based on the 2.1D packaging substrate concept. Recently, LG Innotek delivered EMIB-T packaging substrates to SK Hynix for sample testing, and both parties are installing HBM on the substrate to evaluate product characteristics.Currently, EMIB-T packaging substrates are supplied by Japan's Ibiden, Shinkawa Electric, Taiwan's Xinxing Electronics, and Austria's AT&S. Ibiden has decided to utilize idle factories to construct a dedicated production line for Intel's EMIB-T substrates, with an investment scale of about 20 trillion Korean won, and it is reported that they have already received advance payments from Google, Amazon, Intel, and others.

first_img Samsung Taylor Semiconductor Fabrication Plant will begin trial operations at the end of this month, with 2-nanometer orders already filled

According to South Korea's "Cultural Daily," Samsung Electronics' wafer fab in Taylor, Texas, is expected to enter trial operation around the end of this month, as orders for 2-nanometer chips from Tesla, Broadcom, Arm, and others continue to pour in, with pre-production capacity nearing full load. The plant has accumulated an investment of $37 billion since 2022, with plans to begin trial operation early next month and mass production next year, with an initial monthly capacity of about 50,000 wafers, close to TSMC's approximately 80,000 wafers.The report states that the Taylor plant will produce Tesla's next-generation artificial intelligence chip AI5, Broadcom's new generation communication chips, and Arm's smart device AI chips, among others. Samsung's 2-nanometer yield has increased from about 60% earlier this year to around 80% recently. The company sent personnel for process, equipment, and yield to the plant in June, and began installing equipment in July. At a recent earnings meeting, Samsung projected that this year's 2-nanometer order volume would more than double compared to last year, and stated that NVIDIA's inference chip Grok3 began mass production last month; Samsung also recently raised the foundry price for 4-nanometer chips by up to 15%.The second Taylor plant is scheduled to start construction by the end of this year and begin mass production in 2030. Samsung has requested major partners to complete the relevant production equipment safety certifications in advance, and some partners are considering sending dozens of personnel to the local area. At the same time, Intel issued about $20 billion in new shares last month and expanded investments in 2-nanometer level 18A and 1.4-nanometer level 14A, while Japan's Rapidus completed its 2-nanometer factory in Hokkaido last month and entered the wafer trial production stage.

first_img AUSTRAC in Australia revoked the registrations of 45 cryptocurrency and remittance institutions within a year

Australia's financial intelligence agency AUSTRAC has canceled, suspended, or refused to renew the registrations of 45 cryptocurrency and remittance service providers in the past year to strengthen the scrutiny of high-risk payment businesses. The involved institutions faced issues such as inactivity, insolvency, or lack of operational capability, as well as failure to report significant changes, incorrect registration information, and significant money laundering or terrorism financing risks. AUSTRAC CEO Brendan Thomas stated that businesses whose registrations have been canceled are not allowed to continue operations, and some related individuals have been referred to domestic and international law enforcement or regulatory agencies. AUSTRAC specifically mentioned BA Digital Ventures operating under the name GetCoins, whose virtual asset registration was canceled in June due to customer complaints, allegedly because the platform was exploited by organized cryptocurrency investment scams, with related actions conducted in cooperation with the national anti-fraud center. The public VASP registration list also included recent disposals of institutions such as Cryptolink, Self Custody, Jam Xchange, and Coinsec Australia. Additionally, AUSTRAC has launched an investigation into Western Union and suspended the cryptocurrency ATM network of Cryptolink.

first_img TSMC and others' expansion has driven the top five semiconductor foundries' engineering orders to exceed 880 billion yuan

Taiwan Semiconductor Manufacturing Company, Micron, and other companies are increasing capital expenditures to expand production, driving the combined orders of the top five semiconductor engineering firms—HanTang, Axiom, FanXuan, Yankee, and ShengHui—to exceed 880 billion yuan, a record high. Taiwan Semiconductor Manufacturing Company recently stated at a semiconductor exhibition that it is building up to 20 wafer fabs, with the overall capacity expansion scale increasing multiple times compared to the past, but it still cannot meet customer demand. The U.S. tariff policy has driven the demand for manufacturing plants in the United States. Axiom has the largest order amount of 440.73 billion yuan, and Chairman Yao ZuXiang pointed out that the cumulative amount of turnkey projects undertaken in Singapore over the past four years has reached 600 billion yuan, with expectations for new projects to follow. HanTang's order amount is approximately 193.937 billion yuan, setting a new record, benefiting from continued plant construction by major clients like Taiwan Semiconductor Manufacturing Company and Micron.FanXuan's order amount reached a new high of 135.1 billion yuan, and Chairman Gao XinMing revealed that order visibility extends at least to 2028, with related projects for clients planned for 2029 and 2030. FanXuan has deployed materials, manpower, and local construction teams to support clients in Taiwan, Arizona in the United States, Japan, and Germany in synchronizing production expansion needs, and is investing in the development of technologies such as CoPoS. ShengHui's order amount exceeds 60 billion yuan, with Taiwan accounting for 68% and semiconductor orders accounting for 63%. In the first half of the year, the after-tax net profit was 2.944 billion yuan, with earnings per share of 23.73 yuan, setting a new high for the same period. Yankee's after-tax net profit in the first half of the year was 2.317 billion yuan, with earnings per share of 17.46 yuan, and the order amount is approximately 51.77 billion yuan, with order visibility reaching the end of 2027.

first_img Amazon expands AI cabinet delivery, World Semiconductor, Wistron, and Hon Hai show strong shipments

The supply chain reports that Amazon, a leading North American cloud service provider under AWS, has recently expanded the delivery of AI server cabinets, with strong shipping momentum from partners such as TSMC, World Advanced, Wistron, and Hon Hai. Amazon has recently revised its capital expenditure for this year, increasing the original estimate from $200 billion to $220 billion, primarily for AI infrastructure, including data centers, servers, and network equipment.Amazon CEO Andy Jassy is optimistic that the demand for AI computing power will continue to exceed supply until 2027, and he has even seen strong demand for 2028. AWS's AI business and self-developed chip scale have grown to $25 billion, maintaining triple-digit percentage growth. Annapurna Labs' customized ASIC chips are mostly produced by TSMC using advanced 3-nanometer processes.World Advanced is an important partner for AWS's self-developed AI chips and is optimistic that its quarterly revenue and profits will reach new highs this season, with continued growth expected in the fourth quarter. The demand for 3-nanometer AI accelerators is better than previously assessed, and designs can be finalized before the end of the year. AWS's ASIC AI cabinets are assembled by Wistron, which also supplies switch trays, while Hon Hai is involved in CPU trays. Hon Hai's rotating CEO, Liu Young-way, stated that this year's ASIC project has made new progress, setting a target for ASIC server market share at over 40%.
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