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Flash

Gate Launchpool's three major activities are running simultaneously, and the MarsCat (MCAT) prize pool exceeds one million dollars

According to official news, the Gate Launchpool Phase 375 MarsCat (MCAT) event is currently underway and will last until September 24 at 20:00 (UTC+8). Users can stake USDT, GT, or MCAT to share 2,000,000 MCAT tokens for free, with the current prize pool exceeding one million dollars. Among them, the total amount of USDT staked has reached 83,708,714.6 USDT, with an estimated annualized return rate of 13.69%; the estimated annualized return rate for the GT staking pool is 174.53%; and the estimated annualized return rate for the MCAT staking pool is 7522.57%.In addition, the Gate Launchpool CP and ALIGN events are simultaneously ongoing, with three major Launchpool activities running in parallel, providing users with diverse staking options. In the Gate Launchpool CP event, the total amount of ETH staked has reached 15,974.39 ETH, with an estimated annualized return rate of 3.15%; the estimated annualized return rate for the BTC staking pool is 1.41%; and the estimated annualized return rate for the CP staking pool is 61.65%. In the Gate Launchpool ALIGN event, the total amount of USDT staked has reached 137,165,777.41 USDT, with an estimated annualized return rate of 4.76%; the estimated annualized return rate for the GT staking pool is 0.96%; and the estimated annualized return rate for the ALIGN staking pool is 116.85%.

According to the SpaceX stock unlocking arrangement, Gate will simultaneously support the unlocking of Pre-IPO (stock) shares

According to the SpaceX stock unlocking schedule, the first batch of shares for Gate Pre-IPOs project SpaceX (SPCX) will be unlocked on August 26 at 20:00 (UTC+8). The total amount of the first batch to be unlocked is 33,900 SPCX, with 20% of the shares being unlocked based on the actual holdings at the time of the user’s spot account snapshot, and the corresponding shares will be directly credited to the Gate stock account at a 1:1 ratio.Gate is the first platform in the industry to support Pre-IPO share unlocking and directly distribute listed company stocks to users. This unlocking includes SPCX that users previously acquired and held through Pre-IPOs, as well as SPCX purchased subsequently; SPCX that has been sold will not be included in this round of unlocking. Users need to check their SPCX holdings and open orders in advance to ensure that the SPCX used for this unlocking is in an available state.Gate will continue to provide users with an asset participation experience from Pre-IPOs subscription before listing, internal trading, to stock unlocking entering the U.S. stock market. This is the first 20% stock unlocking for SpaceX (SPCX), and the remaining portion will be processed according to the unlocking rules of the target company as soon as possible, subject to the official announcement from Gate.

hot_img NVIDIA's Feynman platform is expected to go into mass production in 2028, with TSMC's A16 and SoIC expanding production simultaneously

According to DIGITIMES, NVIDIA's next-generation AI platform Feynman aims for mass production in the second half of 2028, utilizing TSMC's A16 process and incorporating SoIC 3D stacking and CPO technology. The Rubin generation focuses on integrating multiple small chips with HBM, while Feynman further develops towards 3D small chips, SoIC, and CPO. The report indicates that TSMC is accelerating the construction of related production capacity, with the original plan for SoIC monthly capacity to reach 20,000 pieces by the end of 2026, now updated to a target of 50,000 pieces by the end of 2027.The construction progress of TSMC's Chiayi AP7 and Tainan AP8 is also accelerating, with AP7 planned in 8 phases. P1 and P2 have entered installation, P3 and P4 have obtained construction permits, and P5 to P8 are still in planning. In addition to mass-producing Apple-specific WMCM, the factory will configure SoIC, CoPoS, and CPO production lines according to customer demand. NVIDIA has rapidly shifted its R&D and supply chain resources to the Feynman platform, and the spillover effect of TSMC's advanced packaging orders continues to expand, with Siliconware becoming the main testing and packaging factory for NVIDIA's CoWoS and CPO orders. The NVLink interconnect bandwidth of NVIDIA's Feynman platform is expected to exceed 1 PB/s, further improving from Rubin Ultra's 520 TB/s. TSMC's COUPE technology integrates EIC and PIC in 3D through SoIC to form a light engine, advancing optoelectronic conversion from traditional circuit boards to the internal packaging structure. Since 2026, NVIDIA has invested over $40 billion in building the AI ecosystem, covering areas such as models, wafer manufacturing, data centers, and optical communications.
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