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first_img India's SEBI tokenized bond pilot fundraising exceeds 100 million USD

The Securities and Exchange Board of India (SEBI) announced on Thursday that three issuers raised a total of 102.5 million rupees (approximately 10.72 million USD) through its Demat 2 pilot program by issuing tokenized corporate bonds. This pilot utilizes distributed ledger technology to issue, hold, and settle corporate bonds.REC Ltd. was the first to issue on September 7, raising 50 million rupees (approximately 5.23 million USD) from 18 investors; L&T Ltd. raised a similar amount from 4 investors on September 9, and IIFL raised 25 million rupees (approximately 2.6 million USD) from 1 investor on the same day. SEBI stated that the pilot infrastructure records corporate bonds in the form of native digital tokens on a distributed ledger owned by the depository and achieves atomic settlement of bonds and funds through a unified market interface connected to the Reserve Bank of India’s wholesale central bank digital currency.This mechanism can reduce settlement risks arising from the separation of securities and funds transfer, allowing issuers to receive funds on the same day as the bidding, whereas the existing process typically takes two to three days. The regulator noted that the information of bondholders on the shared ledger is instantly visible to all authorized entities, and at maturity, e₹ payments will go directly into the bondholders' central bank digital currency wallets. SEBI clarified that this pilot does not create a new category of corporate bonds; tokenized bonds retain the same ISIN, issuer obligations, coupon, maturity, covenants, ratings, and investor rights as traditional paperless bonds. The pilot will be implemented in three phases, with the first phase covering institutional issuance, while secondary trading and retail access will be conducted in subsequent phases within SEBI's regulatory sandbox.

first_img TrendForce: The top ten foundry revenues before the second quarter of 2026 are nearly 53.49 billion USD

TrendForce's latest research on the wafer foundry industry shows that in the second quarter of 2026, the total revenue of the world's top ten wafer foundries increased by 11.5% quarter-on-quarter, approaching $53.49 billion, setting a new record. The growth mainly comes from the continued demand exceeding supply for advanced processes in AI and HPC processors, as well as the rising demand for peripheral AI chips such as PMICs and power discrete devices; the early stocking of consumer supply chains for TVs, PCs, and laptops has also tightened the capacity of some mature processes.TSMC continues to lead, with revenue nearing $40.2 billion in the second quarter, a quarter-on-quarter increase of 12.1%, and a market share of 72.5%. The demand for AI server GPUs and XPUs has kept its 5/4 nm and 3 nm capacities fully loaded, and the initial stocking of the new iPhone has also contributed, with 2 nm making its first revenue contribution. Samsung Foundry ranks second, with revenue of $3.26 billion, a slight quarter-on-quarter increase of 1.8%, and a market share dropping to 5.9%. SMIC ranks third, with revenue exceeding $3 billion, a quarter-on-quarter increase of 20%, and a market share rising to 5.4%, narrowing the gap with Samsung.UMC maintains fourth place, with revenue of nearly $2.18 billion, a quarter-on-quarter increase of 12.7%, and a market share of 3.9%. GlobalFoundries is fifth, with revenue of approximately $1.79 billion, a quarter-on-quarter increase of 9.3%, and a market share of 3.2%. Hua Hong Group ranks sixth, with revenue exceeding $1.27 billion, a quarter-on-quarter increase of 3.5%. Tower, World Advanced, Jinghe Integrated, and Powerchip rank seventh to tenth, with revenues of $460 million, $451 million, $447 million, and $432 million, respectively.

first_img SK Hynix stated that 3D DRAM development can utilize foundry processes

SK Hynix stated on the 9th that the development of the next-generation memory 3D DRAM semiconductor can utilize foundry processes. The day before, at the 2026 SK Hynix Future Forum held at the Supex Center in the Icheon campus, Vice President Kim Kyung-hoon and Son Ho-young presented the main technical directions for 3D DRAM, including the use of logic foundry processes for DRAM peripheral circuits, maximizing data bus bandwidth, and ultra-short distance transmission.3D DRAM is the next-generation DRAM that vertically stacks the originally planar storage cells to improve integration. The two stated that achieving this technology requires addressing not only design and heat dissipation issues but also challenges in fine interconnections, bonding, and process integration in the packaging field. As the boundaries between front-end and back-end packaging, foundry, and memory technology converge, collaborative optimization beyond existing fields will become more important. Son Ho-young mentioned that 3D technology is changing the technological boundaries between wafer fabs and packaging, and it is necessary to establish an optimization and new collaboration system that transcends existing fields alongside innovations in advanced packaging technology.In a related presentation, Professor Shin Chang-hwan from Korea University stated that 3D DRAM is not only about the vertical stacking of chips but also a technology that breaks the boundaries between memory and logic. As device miniaturization approaches its limits and the time and power consumption associated with data movement between systems and memory increases, the shift to 3D technology is inevitable. He proposed a 3D integrated design framework that links materials, devices, packaging, and architecture through artificial intelligence. SK Hynix President Kwon Oh-joon, in his speech, remarked that the past memory market resembled a straight road where the competition was about who could run faster, but now it resembles a constantly changing curve, making it important to grasp the speed and direction of external environmental changes and adapt flexibly in addition to internal capabilities.

first_img The Curve soft liquidation mechanism allows hundreds of loans to survive in a liquidation state for several weeks

According to CoinDesk, data from Curve Finance shows that its lending market has recorded a total of 704 "soft liquidation" events, involving 602 borrower addresses, with a median duration of 14.5 days, of which a quarter lasted at least 38.9 days, and some positions remained within the liquidation range for several months. Of these soft liquidations, 476 began in the first half of 2026. Unlike traditional lending protocols such as Aave and Compound, Curve's LLAMMA system does not sell off collateral all at once after the price drops below a threshold, but gradually converts collateral into borrowed assets within a price range. If the price rebounds before the loan completely fails, some or all of the conversions may be reversed. This means that borrowers are not in a grace period; their collateral has been partially liquidated during the loan's duration, but they still have the opportunity to restore their positions if the price reverses. However, soft liquidations are not without costs. Data shows that borrowers may still incur losses due to transaction fees, conversions, rebalancing, interest, and bid-ask price fluctuations, and if the market remains unfavorable, positions may still fall into hard liquidation. Curve Finance is a mainstream DeFi protocol focused on stablecoin exchanges and crvUSD lending, currently holding approximately $1.35 billion in deposits, with a DEX trading volume of about $3.4 billion over the past 30 days and active loans of about $46 million.

first_img TSMC and others' expansion has driven the top five semiconductor foundries' engineering orders to exceed 880 billion yuan

Taiwan Semiconductor Manufacturing Company, Micron, and other companies are increasing capital expenditures to expand production, driving the combined orders of the top five semiconductor engineering firms—HanTang, Axiom, FanXuan, Yankee, and ShengHui—to exceed 880 billion yuan, a record high. Taiwan Semiconductor Manufacturing Company recently stated at a semiconductor exhibition that it is building up to 20 wafer fabs, with the overall capacity expansion scale increasing multiple times compared to the past, but it still cannot meet customer demand. The U.S. tariff policy has driven the demand for manufacturing plants in the United States. Axiom has the largest order amount of 440.73 billion yuan, and Chairman Yao ZuXiang pointed out that the cumulative amount of turnkey projects undertaken in Singapore over the past four years has reached 600 billion yuan, with expectations for new projects to follow. HanTang's order amount is approximately 193.937 billion yuan, setting a new record, benefiting from continued plant construction by major clients like Taiwan Semiconductor Manufacturing Company and Micron.FanXuan's order amount reached a new high of 135.1 billion yuan, and Chairman Gao XinMing revealed that order visibility extends at least to 2028, with related projects for clients planned for 2029 and 2030. FanXuan has deployed materials, manpower, and local construction teams to support clients in Taiwan, Arizona in the United States, Japan, and Germany in synchronizing production expansion needs, and is investing in the development of technologies such as CoPoS. ShengHui's order amount exceeds 60 billion yuan, with Taiwan accounting for 68% and semiconductor orders accounting for 63%. In the first half of the year, the after-tax net profit was 2.944 billion yuan, with earnings per share of 23.73 yuan, setting a new high for the same period. Yankee's after-tax net profit in the first half of the year was 2.317 billion yuan, with earnings per share of 17.46 yuan, and the order amount is approximately 51.77 billion yuan, with order visibility reaching the end of 2027.
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