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first_img SK Hynix stated that 3D DRAM development can utilize foundry processes

SK Hynix stated on the 9th that the development of the next-generation memory 3D DRAM semiconductor can utilize foundry processes. The day before, at the 2026 SK Hynix Future Forum held at the Supex Center in the Icheon campus, Vice President Kim Kyung-hoon and Son Ho-young presented the main technical directions for 3D DRAM, including the use of logic foundry processes for DRAM peripheral circuits, maximizing data bus bandwidth, and ultra-short distance transmission.3D DRAM is the next-generation DRAM that vertically stacks the originally planar storage cells to improve integration. The two stated that achieving this technology requires addressing not only design and heat dissipation issues but also challenges in fine interconnections, bonding, and process integration in the packaging field. As the boundaries between front-end and back-end packaging, foundry, and memory technology converge, collaborative optimization beyond existing fields will become more important. Son Ho-young mentioned that 3D technology is changing the technological boundaries between wafer fabs and packaging, and it is necessary to establish an optimization and new collaboration system that transcends existing fields alongside innovations in advanced packaging technology.In a related presentation, Professor Shin Chang-hwan from Korea University stated that 3D DRAM is not only about the vertical stacking of chips but also a technology that breaks the boundaries between memory and logic. As device miniaturization approaches its limits and the time and power consumption associated with data movement between systems and memory increases, the shift to 3D technology is inevitable. He proposed a 3D integrated design framework that links materials, devices, packaging, and architecture through artificial intelligence. SK Hynix President Kwon Oh-joon, in his speech, remarked that the past memory market resembled a straight road where the competition was about who could run faster, but now it resembles a constantly changing curve, making it important to grasp the speed and direction of external environmental changes and adapt flexibly in addition to internal capabilities.

Coinbase launches AiFi financial system: x402 has processed over 205 million transactions

Coinbase stated on the X platform that the financial layer surrounding AI agents is referred to as agent finance, or AiFi, which encompasses agent trading and agent commerce. AI agents can research information, make decisions, and execute operations on behalf of individuals and businesses, and they need to perform basic financial activities such as payments, receipts, value storage, and fund transfers. Coinbase claims that it is building tools for AI agents to continuously execute financial operations within predefined goals, permissions, limitations, and security boundaries.Coinbase indicated that Coinbase Advisor, Coinbase for Agents, x402, and Coinbase Business have formed the AiFi infrastructure. Coinbase Advisor is an SEC-registered investment advisor integrated into the app for Coinbase One users, providing portfolio analysis and guidance through a chat interface; Coinbase for Agents connects tools like Claude, ChatGPT, and Cursor to Coinbase accounts via MCP, allowing users to set operational conditions and security boundaries for agents, as well as create independent sandbox accounts for agent use.Coinbase stated that x402 is an open payment standard initiated by Coinbase and currently managed by an independent foundation, which supports AI agents in paying fees to other agents, applications, and services. As of now, x402 has processed over 205 million transactions, with a transaction volume of $53 million, covering 200,000 sellers, with Coinbase facilitating 67% of the activities. Single payments can be used for API calls, datasets, research materials, or computing resources.Coinbase indicated that Coinbase Business supports enterprises in natively receiving AI agent payments in USDC, and Coinbiz can help merchants sell services and content to software without relying on credit card credentials, manual invoicing, or payment processes designed with human customers in mind. Eligible businesses can earn a floating reward of 3.35% from idle USDC balances. USDC currently accounts for 99% of on-chain agent commerce transactions, while x402 represents 97% of agent finance protocol usage, with related activities operating on Base.

The Sandbox: Compensation will be carried out based on the on-chain snapshot before the attack, and the compensation application process is expected to open within two weeks

The Sandbox released an update on the security vulnerability attack incident involving the SAND cross-chain bridge, stating that the attacker modified the verification mechanism to forge cross-chain deposit messages and mint unbacked SAND. This incident resulted in approximately 14.7423 million SAND being withdrawn, valued at about $697,000. Additionally, some uncollateralized SAND was profited through market trading, leading to an overall economic impact of approximately $1.497 million, of which the attacker actually obtained about $987,000.The Sandbox stated that the attack did not affect the supply of SAND on Ethereum and Polygon, with the total amount of SAND on Ethereum remaining unchanged at 3 billion. There were also no super administrator privileges stolen, and the attack stemmed from a vulnerability caused by the combination of the general call function in the token contract and the design of bridge permissions. Currently, the related addresses have been marked, and collaboration has begun with exchanges, security agencies, and the LayerZero team.For affected users, The Sandbox promises to compensate wallets holding legitimate bridged SAND with a 1:1 ratio of SAND on the Ethereum chain based on an on-chain snapshot taken before the attack. The compensation application process is expected to open within two weeks and will last for two weeks.

first_img Market news: Intel's Razor Lake may adopt TSMC's N2X process

According to the Industrial and Commercial Times, competition in advanced process technology for PC processors is heating up. Market news indicates that Intel's next-generation Nova Lake desktop processor will prioritize the introduction of bLLC large last-level cache to reduce access latency to system memory, competing with AMD's 3D V-Cache technology; the laptop version may be delayed until the subsequent Razor Lake-HX generation is released. The supply chain reveals that Nova Lake, set to debut early next year, will utilize a combination of Intel's 18A and TSMC's N2P processes, while the subsequent Razor Lake may further adopt TSMC's high-performance 2-nanometer N2X process.N2X is a high-performance extension of TSMC's N2 platform, targeting high-frequency CPUs, AI, and HPC applications, with transistor technology shifting from FinFET to nanosheets. If mass production is achieved, Intel's collaboration with TSMC on advanced processes is expected to extend to a broader 2-nanometer family, helping to reduce risks associated with a single proprietary process and optimize the timing and capacity configuration for high-end CPU launches.In addition to TSMC benefiting directly, related supply chains are also expected to welcome business opportunities. Sungsan is one of the few manufacturers in Taiwan capable of mass-producing its own CMP polishing pads, with a 25% year-on-year increase in consolidated semiconductor revenue in the first half of the year, rising to 66% of total revenue. Demand for Hard Pads and advanced packaging is strong, with a new Soft Pad line expected to begin trial production in the third quarter and gradually ramp up production in the fourth quarter, with products already applied in CoWoS and SoIC. Zhongsha holds CMP diamond discs and recycled wafers, reporting revenue of 2.49 billion yuan in the second quarter, a year-on-year increase of 17.9%, with gross margin rising to 40.1%, and shipments of 2-nanometer and 1.6-nanometer related diamond discs rapidly increasing.
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