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first_img North Korea uses IT employees from third countries to infiltrate American companies, paying interview assistants with cryptocurrency

According to NBC, North Korea is utilizing remote IT workers from third countries such as Iran and Lebanon to assist in infiltrating American companies and obtaining funds to finance its weapons programs. Alerts issued by the U.S. and several foreign agencies in July indicated that North Korean IT workers "seek to sign contracts with the intention of remitting salaries back to relevant North Korean agencies," while also posing internal threats to companies, involving data leaks, cryptocurrency theft, and sensitive information theft.As governments like the United States increase countermeasures, North Korea is increasingly leveraging third-country IT workers to secure job interviews, and after obtaining work contracts, the relevant positions are typically taken over by North Korean agents. Reports indicate that these foreign IT workers are scouted on LinkedIn, with some earning about $500 per month in cryptocurrency to work part-time as "interview assistants."Cointelegraph reported in May, citing data from cybersecurity company CrowdStrike, that state-affiliated North Korean hackers and threat actors caused cryptocurrency losses exceeding $2 billion in 2025, a 51% increase year-on-year. The Bank of Korea estimates that despite facing global sanctions, North Korea's GDP will still grow by 3.5% in 2025.

first_img Former Alameda CEO Caroline Ellison joins the nonprofit charity organization Manifund

Former Alameda Research CEO Caroline Ellison has joined the nonprofit organization Manifund. Manifund co-founder Austin Chen stated that Ellison will be responsible for developing the organization’s donation platform and enhancing its charitable work. Ellison has been on a trial basis at the organization since July, transitioned to full-time in August, and has been posting work updates under the alias "Carol."Ellison pleaded guilty in December 2022 to fraud and conspiracy charges related to the collapse of the FTX exchange in 2022, which resulted in billions of dollars in customer losses. She cooperated with prosecutors and testified against FTX founder Sam Bankman-Fried, who was sentenced to 25 years in prison. Ellison is set to begin serving a two-year sentence in November 2024 and will be released early in January 2026 for cooperating with the investigation.Chen stated in a post, "I believe in redemption. Caroline has acknowledged her mistakes, is working to repay creditors, and has served time in prison. I hope the world can recognize that too." Ellison expressed excitement about her new position, apologized for her past actions, and thanked Austin for giving her a second chance, stating that he judges her based on her current work performance rather than her past. According to its website, Manifund focuses on artificial intelligence safety and effective altruism projects.

Researchers claim that purchasing 6TB of relay station data can breach 19 companies including Huawei and Xiaomi

Security researcher Shou Chaofan stated that he just purchased about 6TB of Fable model invocation data from a leading Chinese model relay station, which included sensitive credentials such as SSH keys, VPN configurations, Alibaba Cloud keys, and GitLab tokens. He claimed that the keys in this batch of data were sufficient for him to access the servers or internal systems of 19 leading Chinese companies, as well as 7 Chinese and CIS government-related agencies, including Huawei, Xiaomi, NIO, and MiniMax.The model relay station is positioned between users and models like Claude, so requests and responses pass through it first, allowing it to see the complete plaintext. Once developers insert SSH Keys, API Keys, VPN configurations, etc., into the Agent context, if the relay station saves or even sells these records, the company's system keys will also leak out. This is not the first time Shou Chaofan has warned about the risks of relay stations. A paper he participated in tested 428 LLM relay stations in April and found that 9 actively injected malicious code, 17 actually used AWS test keys deliberately placed by researchers to call AWS, and 1 directly transferred ETH from the test wallet.Shou Chaofan is a co-founder of the blockchain security company Fuzzland and has long been engaged in vulnerability and supply chain security research. At the end of March, he also first discovered that the source map in the Claude Code 2.1.88 release package accidentally exposed about 500,000 lines of TypeScript source code.

first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.
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