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first_img TSMC CoWoS price quotes are reported to be raised, with an increase of up to 20%

According to the Industrial and Commercial Times, the supply chain reveals that TSMC's CoWoS pricing is brewing a new wave of increases, with an increase of up to 20%. Some packaging delivery times have already been extended, and the pressure from tight capacity continues to rise. The rush for capacity has spread to the equipment side, and customers have no time to negotiate prices; as long as they can promise delivery times, they place orders, with equipment delivery times extending to a maximum of 8 months.Chip manufacturers point out that the demand for advanced packaging has spread from AI GPUs to server CPUs and customized ASICs, with unfulfilled orders continuing to increase. The testing time for AI chips has lengthened, putting pressure on the synchronization of packaging and testing capacity. Wafer foundries and packaging testing companies are preparing to adjust CoWoS pricing, estimating an increase of 10% to 20%. Equipment manufacturers reveal that TSMC has not renegotiated prices this year, directly purchasing at original prices without any increase in equipment functionality, with equipment delivery times extending from the past 3 to 6 months to 6 to 8 months.TSMC Chairman C.C. Wei stated at the recent earnings call that CoWoS remains the first choice for customers, with five-fold photomask size packaging already in mass production, and the development of nine-fold and fourteen-fold photomask size solutions is ongoing, while advancing CoPoS technology. Analysts estimate that by 2026, CoWoS monthly production capacity will advance to over 130,000 pieces, aiming for 200,000 pieces by 2027; related layouts include Chiayi AP7, Tainan AP8, and AP6, with the advanced packaging plant in the U.S. AP1 planned to start production in 2028.

first_img TSMC 3/2 nanometers and CoWoS remain tight, AWS and MediaTek's capacity allocation has changed

As we enter the late third quarter of 2026, TSMC's 3nm and 2nm advanced process and CoWoS advanced packaging capacity continue to be in high demand. NVIDIA and Apple continue to dominate the resources for advanced processes and packaging; Amazon AWS's Annapurna has recently increased its AI self-developed chip production, securing more 3nm capacity. MediaTek, in addition to mobile chips, is also competing for 2/3nm process and CoWoS-S/L capacity with large orders related to Google TPU.There are reports that TSMC has recently readjusted its capacity allocation. After MediaTek secured a large order from Google TPU, the next-generation TPU v9 will simultaneously use TSMC's CoWoS-L and Intel's EMIB-T, which has slightly adjusted MediaTek's 3nm and 2nm capacity arrangements. Currently, TSMC's main customer for 3nm is NVIDIA, which is expected to surpass Apple to become the largest customer by 2025; the demand for 2nm is primarily from Apple and others. After AWS increased Annapurna's production, its 3nm and CoWoS configuration priority has improved.Starting in early 2026, TSMC will accelerate capacity expansion, with the 2nm monthly capacity of Hsinchu Baoshan Fab 20 and Kaohsiung Fab 22 reaching 50,000 wafers each by the end of October, totaling about 100,000 wafers; by the end of October, the monthly capacity for 3nm in Tainan Science Park is about 185,000 wafers. As of the end of September, the overall capacity utilization rate is about 96.2%, with 100% utilization for processes below 16/12nm down to 2nm. The shortage of CoWoS supply has driven advanced packaging orders to overflow, with the priority for orders going to ASE Group's Siliconware Precision Industries first, followed by Amkor, and Chipbond, among others. Chipbond's related testing and packaging capacity is fully loaded, with order visibility extending to 2028.

hot_img TSMC's CoWoS orders are overflowing, and it is reported that Intel's Malaysia factory will support backend packaging

According to the Economic Daily, TSMC's advanced packaging CoWoS capacity is in short supply, and it has been reported that some backend orders have overflowed to Intel's factory in Malaysia, where Intel is assisting with packaging using part of its capacity to serve common major customers, breaking the past ecosystem competition norms. TSMC Chairman Wei Zhejia previously stated at a conference call that TSMC focuses on advanced packaging in the frontend and welcomes "more manufacturers to supply capacity" for the shortage in the backend, providing flexible alternatives for common customers.The report points out that the bottleneck in advanced packaging capacity mainly lies in the backend ramp-up speed being lower than that of the frontend process, and the widening gap in CoWoS capacity has forced orders to overflow. SemiAnalysis Chipbook data shows that approximately $1.3 billion worth of HBM has been shipped to Malaysia, and industry analysis indicates that Intel's local factory should already have the capability for large-scale HBM integration. Intel CEO Pat Gelsinger stated that the EMIB-T technology is ensuring reliable yield, and in the context of insufficient CoWoS capacity, "Intel is in a unique position to provide support." Companies with overlapping supply chains such as Unimicron, ASE Technology Holding, and Jiadeng are expected to benefit simultaneously, with Unimicron's stock price rising over 7% on that day. Intel's EMIB-T related applications are targeted for mass production by 2027.
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