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first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.

hot_img The Korea Exchange examines the technical feasibility of temporarily banning short selling and reducing price limits

According to the Korea Herald, the Korea Exchange conducted an internal review on July 29 regarding the technical feasibility and system requirements for a temporary ban on short selling and narrowing the price limit (currently at 30%) to address the recent severe fluctuations in the stock market. Sources familiar with the matter stated that "only technical feasibility was confirmed," and it was not a prerequisite for implementation, but rather a screening process during the review of available emergency measures.Recently, the South Korean stock market has continued to plummet, causing increasing damage to individual investors. During a meeting of the National Assembly's Administrative Committee, several lawmakers urged authorities to consider a temporary ban on short selling and to restart the Securities Market Stabilization Fund. A national petition to suspend short selling garnered over 10,000 signatures within two days of being made public. However, the ban on short selling conflicts with South Korea's goal of being included in the MSCI developed market index; a previous 17-month short selling ban from November 2023 to March 2025 had led to MSCI downgrading South Korea's market accessibility rating. The exchange's officials stated that they have not received any related requests from the government and have not formally discussed a short selling ban.
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