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Cardone Capital increased its holdings by 20 BTC, Metaplanet established a subsidiary in Asia to expand its Bitcoin financial landscape

According to BBX data, global capital giants and publicly listed Bitcoin treasury companies disclosed the latest developments in asset purchases and asset management entities over the weekend. The core information is as follows:Cardone Capital increases its holdings by 20 Bitcoins: Grant Cardone, CEO of the well-known real estate investment company Cardone Capital, stated on social media that the company has recently increased its holdings by 20 Bitcoins in the secondary market, continuing to view it as an important component in combating traditional fiat currency inflation and optimizing treasury allocation.Metaplanet establishes an Asian asset management subsidiary to accelerate the advancement of the "Project Nova" strategy: The Japanese listed company Metaplanet (TSE: 3350) officially announced the establishment of a wholly-owned subsidiary, Metaplanet Asset Management Asia Limited, as the group's core trading execution and asset management hub during the Asian time zone. The initial capital contribution for this subsidiary is set at 1 million USD, with an expected official establishment in September 2026. This entity will collaborate with the previously established asset management company (MAM) in Miami, USA, to form a 24-hour cross-time zone synergy, focusing on asset trading execution, position risk control, and market dynamics monitoring during the Asian time zone. Its main investment targets include Bitcoin, Bitcoin-related stocks, and priority securities issued by Bitcoin treasury companies, among other credit instruments. This move is an important step for Metaplanet in advancing the "Project Nova" Bitcoin financial platform strategy, and the company expects this investment to have a slight impact on the consolidated performance for the period ending December 2026.

first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.
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