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Flash

first_img TrendForce: The contract price of high-capacity NOR Flash may rise by 90%–110% in the second half of the year

TrendForce's latest research on the memory industry indicates that the NOR Flash market is experiencing the most significant supply-demand structural change in nearly a decade. AI-related products are absorbing a large amount of capacity, and suppliers find it difficult to significantly increase NOR Flash bit output despite the continuous growth in high-end application demand. Therefore, the supply-demand imbalance is expected to persist in the second half of 2026, with overall contract prices remaining high.Although suppliers in Taiwan and China have increased capital expenditures and expanded production, the new capacity cannot be immediately converted into market supply. New output must first go through process migration, yield ramp-up, product certification, and customer design integration, making it difficult to alleviate the supply shortage in the mid-to-high capacity segment in the short term. Winbond expects the strongest bit growth in 2026, driven by the full-scale production of 45nm NOR and the migration to 25nm and 20nm. GigaDevice is upgrading the process for products of 32Mb and above, with effective output limited in the first half of the year. MXIC will prioritize additional 12-inch capacity for NAND and eMMC, limiting the growth of NOR wafer input.In 2026, AI and aerospace communications will become the main sources of new demand. The NOR usage in AI servers is 3-5 times that of traditional servers, with high-density demand driven by edge AI, AI PCs, robotics, and low-orbit satellites. In the first half of 2026, the average cumulative contract price increased by 100-120%. In the second half, the average price of products of 256Mb and above may rise by another 90-110%, while prices for products of 128Mb and below are expected to increase by 10-20% in Q4 2026.

first_img Maharashtra, the richest state in India, plans to tokenize its electricity assets for financing

The wealthiest state in India, Maharashtra, is formulating policies to tokenize state government assets (including power transmission infrastructure), with the funds raised to be used for constructing new transmission lines and energy storage facilities. The Chief Minister's Chief Economic Advisor and CEO of the Maharashtra Transformation Institute (MITRA), Praveen Pardeshi, introduced this plan at an invitation-only event called "The Box Launch," hosted by the real estate tokenization company RealX and MST Blockchain at the Mumbai World Trade Center.Pardeshi stated that transmission lines could be partially tokenized, for example, 40% to 50%, allowing investors holding tokens to receive a portion of the revenue from Maharashtra Transco. The new funds generated from token sales could be used to build more transmission lines and solar energy storage centers. He pointed out that the state currently has a significant surplus of solar power but lacks the grid capacity to deliver it to where it is needed; distribution companies must pay high prices of 16 to 18 rupees per unit during peak hours, while the price during surplus periods on the power exchange is only 2 paise per unit.He also illustrated the practice of real estate tokenization with the example of the Mumbai Express Towers commercial building tokenized under a REIT structure, emphasizing that tokenization does not equate to privatization but rather allows more citizens to participate in the development activities of public asset creation. Additionally, the state is drafting the Maharashtra Digital and Land Token Asset Trading Act (DELTA Act), which, if passed, will make it the first state in India to legislate for blockchain-based property tokenization.

first_img Licheng, Jingyuan Electronics, and Silergy experienced a double increase in revenue in August, and Licheng's panel-level packaging capacity has been fully booked

Licheng, Jingyuan Electronics, and Silergy all reported year-on-year and month-on-month revenue growth in August, with Licheng and Silergy setting new historical highs for two consecutive months. Licheng's consolidated revenue in August was 8.558 billion New Taiwan Dollars, a month-on-month increase of 3.48% and a year-on-year increase of 24.46%. After breaking the 8 billion mark for the first time in July and setting a historical high, August saw another record. The cumulative revenue for the first eight months reached 61.258 billion New Taiwan Dollars, a year-on-year increase of 30.83%. Jingyuan Electronics reported revenue of 4.08 billion New Taiwan Dollars in August, a month-on-month increase of 2.23% and a year-on-year increase of 31.58%. The cumulative revenue for the first eight months was 29.404 billion New Taiwan Dollars, a year-on-year increase of 35.53%. Silergy's revenue in August was 2.07 billion New Taiwan Dollars, with a month-on-month increase of nearly 3% and a year-on-year increase of nearly 29%. The cumulative revenue for the first eight months reached 15.26 billion New Taiwan Dollars, a year-on-year increase of over 20%.Licheng's main source of growth this year remains the rebound in demand for memory packaging and testing. Licheng previously anticipated that revenue in the third quarter would show single-digit quarter-on-quarter growth, with the fourth quarter having the potential to exceed the third quarter. The momentum for memory orders is expected to continue until the end of the year, with a positive market outlook at the beginning of next year. In addition to its core memory business, advanced packaging has become a key focus for the next phase of development. The panel-level packaging has already been adopted by American clients, and the production capacity of the P11 plant has been secured by clients, with plans to enter the mass production phase of integrated ASIC and HBM AI chips by mid-2027.Jingyuan Electronics has been actively expanding its high-end testing capacity in recent years, with AI-related products becoming an important driving force for its operations. The testing demand for AI GPUs, ASICs, and high-performance computing chips remains its main source of growth. Silergy pointed out that the demand for AI and high-speed interconnects is strong, including an increase in demand for high-performance computing chips such as CPUs, GPUs, ASICs, and AI accelerators. After completing the cleanroom construction at the newly acquired Hukou plant in February, Silergy began mass production in July, currently achieving 40% of the total capacity of the plant and gradually taking on new demand from overseas clients.

first_img Samsung's 4-nanometer production capacity is more than half used for HBM4 substrate chips

Samsung Electronics' wafer foundry division has recently surpassed 50% in the allocation of production capacity for the sixth-generation high bandwidth memory HBM4 substrate chips in the 4-nanometer process. The industry states that this division will invest more than half of its 4-nanometer wafers into HBM4 substrate chip manufacturing in the second half of this year to expand supply to companies like NVIDIA, Broadcom, and AMD.Samsung initiated mass production and shipment of HBM4 in February this year and plans to increase supply starting from the third quarter, significantly increasing the related wafer input since mid-year. This chip is based on Samsung's wafer foundry 4-nanometer (SF4) process. As of last month, over 50% of its total 4-nanometer capacity has been allocated to HBM4 substrate chips. According to insiders, Samsung's 4-nanometer process is currently at full capacity, with HBM4 substrate chips accounting for about 50% to 60%, and this high proportion will be maintained in the second half of the year.Samsung's wafer foundry production lines at Pyeongtaek Plant 2 and Plant 3 are mass-producing processes ranging from 4 to 7 nanometers, with a monthly capacity of about 30,000 wafers for the 4-nanometer process. Based on this, the wafer input related to HBM4 substrate chips is estimated to be about 15,000 wafers per month. During the second quarter earnings call, Samsung stated that it expects HBM4 revenue to increase more than threefold quarter-over-quarter in the third quarter, with HBM4 revenue in the second half expected to exceed 60% of the company's overall HBM revenue.

first_img Micron plans to expand HBM production capacity to approximately 100,000 wafers per month by the end of the year

According to Electronic News on September 3, Micron plans to double its high bandwidth memory (HBM) production capacity compared to last year, with a maximum addition of 60,000 wafers per month by the end of this year. Insiders say that Micron's HBM output was about 40,000 to 50,000 wafers per month last year, and it is expected to reach about 100,000 wafers per month by the end of the year, narrowing the gap with Samsung Electronics and SK Hynix.Micron is increasing procurement orders from multiple HBM equipment suppliers, with production bases mainly in Taiwan and Singapore, continuously introducing equipment. Currently, the output is mainly HBM3E 12-layer, with HBM4 12-layer accounting for about 20% to 30% at the beginning of this year, which may rise to as high as 50% by the end of the year. HBM4 12-layer will be used in NVIDIA's latest AI accelerator, Vera Rubin, and Micron has started mass production of this product since the second quarter of this year.Micron CEO Mehrotra stated in the Q3 earnings call for fiscal year 2026 in June this year that the ramp-up speed of HBM4 12-layer mass production is about twice that of HBM3E 12-layer, and cumulative revenue from HBM4 shipments has exceeded $1 billion. The industry believes that Samsung and SK Hynix each have HBM production capacities of about 150,000 to 200,000 wafers per month. Counterpoint data shows that in Q2 of this year, the global HBM market shares were SK Hynix 50%, Samsung 32%, and Micron 18%. Micron is also preparing related investments in Hiroshima, Japan.
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