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first_img Grok released a seven-minute short film "Odyssey" on AI, and foreign media claimed it lacks artistic quality

According to a report from TechCrunch, Elon Musk announced that Grok would release a full-length, "historically accurate" movie version of "The Odyssey" three months later. On October 23, Grok released the first seven minutes of this AI-generated content, calling it "the first episode of our Odyssey series." This version was produced in collaboration with Wonder Studios and director Dev Walker. The Grok Imagine account posted on X, stating that viewers could comment on whether a complete production analysis is needed.The report mentioned that Musk previously criticized Christopher Nolan's version of "The Odyssey" because Nolan cast non-white and transgender actors. Although Nolan's version heavily utilized visual effects, it was still primarily a live-action film, shot across six countries with thousands of cast and crew members. After its release in July, the film achieved impressive box office results, with IMAX screenings sold out for several months, and it is considered a strong contender for the next Academy Awards.The TechCrunch author, after watching, stated that the video was not as bad as expected; some shots could be mistaken for real actors sailing on real seas, but the historical accuracy could not be determined. The author felt that the footage lacked artistry, inspiration, and warmth; the narration was lengthy, the dialogue stiff, and overall it lacked a sense of breath and momentum, making it hard to imagine that viewers would be interested in another seven minutes or even a whole movie.

first_img The foldable iPhone sold out immediately upon launch, and it is reported that Apple has increased orders by 30%

According to a report by the Economic Daily, Apple's first foldable device, the iPhone Duo, quickly sold out after its launch on October 23 on the official website and major channels, with all models sold out on the same day. The second wave of shipments is expected to arrive on January 22, 2027. Supply chain sources indicate that Apple has requested its partners to expedite production and increase orders by 30%, with optimism surrounding Hon Hai, TSMC, and New Kinpo Group benefiting from this.The report states that scalper prices once reached NT$100,000, a premium of about 33% over the minimum entry price of NT$74,900. Industry insiders noted that the initial stock was insufficient, affected by assembly yield rates and demand exceeding Apple's expectations. Market research firms originally anticipated a stock volume of only 6 million units this year, which was later revised up to 8 million to 10 million units, with shipments expected to reach 33 million units by 2027, and it is estimated that it could capture about 40% of the global foldable device market next year.Supply chain sources indicate that the complete assembly is exclusively handled by Hon Hai, the core processor chips are manufactured by TSMC, and key bearing components are supplied by a joint venture between Hon Hai and New Kinpo Group, with Amphenol as the second supplier. The industry believes that insufficient production capacity is mainly limited by bearing capacity and the difficulty of complete assembly. The above content is a summary of supply chain and market research estimates and is not an official announcement from Apple.

first_img Samsung and SK Hynix respond to HBM4E heat dissipation, AI intermediary layer may expand to 40 times

TrendForce reported on October 12, citing Chosun Biz, that as AI packaging accommodates more computing and storage chips, the intermediary layer connecting computing chips and HBM is expected to significantly increase in size, making next-generation HBM cooling more important. Samsung Electronics is preparing multiple technologies to address the cooling challenges of HBM4E, which is scheduled to begin mass production next year.Currently, the area of the AI intermediary layer is about 5.5 times the maximum exposure area of 858 square millimeters of an EUV lithography machine. Semiconductor equipment industry insiders expect that the intermediary layer carrying HBM could expand to 9 times, 12 times that area, and ultimately about 40 times. Reasons include limitations in process miniaturization and the popularity of chiplet-style 2.5D packaging, where multiple computing chiplets and HBM stacks are placed on the same intermediary layer, making it difficult for a single advanced process chip to meet AI computing power demands.Samsung is considering hybrid copper bonding and thermal path blocks. The former replaces the micro bumps between stacked DRAM chips with direct copper-to-copper connections, which can reduce inter-layer gaps, make the stack thinner, and improve heat dissipation, a technology Samsung showcased at NVIDIA GTC in March 2026. The thermal path block establishes a dedicated thermal path in the D2D PHY area responsible for high-speed transmission between HBM base chips and GPUs, which Samsung is validating with HBM4E and plans to implement in HBM5. According to ETNews, SK Hynix's iHBM places high thermal conductivity but electrically insulating cooling materials around the heat-concentrated D2D PHY, which is expected to reduce thermal resistance by about 30%.
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