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HP and Dell are concerned about circuit board supply in 2027, Amazon invests in Jinxing Electronics

The shortage caused by the AI boom has extended from GPUs and memory to circuit boards. When planning their supply chains for 2027, HP and Dell found that even previously inconspicuous printed circuit boards could face shortages. In September this year, Amazon invested approximately 1.59 billion New Taiwan Dollars in Taiwanese circuit board manufacturer Gold Circuit Electronics, transitioning from customer to shareholder.AI servers require circuit boards with more layers and lower signal loss, and chip packaging substrates are becoming larger, driving up the demand for key materials such as specialty fiberglass cloth and copper-clad laminates. Suppliers prioritize fulfilling more profitable AI orders, squeezing ordinary servers, with some ordinary server circuit board delivery times approaching one year.It is difficult for the production capacity of key materials to keep up with demand in the short term. TrendForce estimates that Japan's Nitto Denko controls about 90% of the global T-glass specialty fiberglass cloth market, with new production capacity not expected to come online until mid-2027 at the earliest. The chairman of Taiwanese substrate manufacturer Unimicron Technology warned on October 20 that some key materials could be short by about 20% by 2027, with delivery times for some chip substrate production equipment extending to as long as 30 months.

first_img Samsung Electronics lowers the production of mid-range and low-end smartphones in the fourth quarter, as the supply of PCB raw materials is hindered

According to a report by ZDNet Korea on October 15, Samsung Electronics has lowered its production plan for mid-range and low-end smartphones in the fourth quarter. The reasons include rising prices of memory chips and disruptions in the supply of glass fiber used in PCB raw materials CCL. Japan's Nitto Denko is shifting more production capacity towards T-glass for AI semiconductors, reducing the output of E-glass for smartphone PCBs, leading to supply shortages and price increases. E-glass is used in semi-cured sheets for smartphone motherboards HDI and RFPCB.The report states that after the rise in storage prices increased manufacturing costs, Samsung reduced orders for related components. Models like the Galaxy A have lower profitability, making it difficult to significantly increase production. This year, the prices of basic mid-range models have risen by more than 100,000 Korean Won compared to the previous generation. The outlook for component orders communicated to partners for the fourth quarter corresponds to an annual smartphone shipment volume of just over 230 million units, which is below the component industry's expectation of 240 million units and represents a decrease of 20% to 30% compared to before the Mid-Autumn Festival holiday. Plans for the mobile business next year have not been shared with partners as in previous years.The monthly production outlook for the fourth quarter in mid-September was 14.3 million units in October, 9.5 million units in November, and 7.6 million units in December, totaling 31.4 million units. This was adjusted at the beginning of this month to 9.9 million units in October, 7.6 million units in November, and 6.7 million units in December, totaling 24.2 million units, a reduction of 23%. While the production of mid-range and low-end models has been lowered, the shipment plans for flagship models like the Galaxy S27 at the beginning of next year remain at a high level, and the shipment volume for foldable phones is also planned to increase. The MX and Network divisions reported a loss of 735 billion Korean Won in the second quarter, with the securities industry projecting an annual loss of 400 billion Korean Won.

first_img The Dutch central bank granted Qivalis an electronic money institution license to issue a euro stablecoin

According to CoinDesk, the consortium Qivalis, supported by 37 major European banks, announced that the Dutch Central Bank (DNB) has granted it an Electronic Money Institution (EMI) license, bringing it closer to issuing Euro-denominated electronic money tokens (EMT). The Amsterdam-based company still needs to meet the remaining requirements of the EU's Markets in Crypto-Assets Regulation (MiCA), including publishing a white paper, in order to issue the token in the coming months.This license enables Qivalis to provide a blockchain-based method for transferring Euros for banks and payment institutions. Qivalis plans to distribute its tokens through banks, cryptocurrency exchanges, and payment service providers, rather than directly to consumers. Since its establishment in September 2025, the consortium has expanded to 37 European banks, including BBVA, BNP Paribas, ING, and DZ Bank, and has chosen Fireblocks to provide digital asset infrastructure.According to MiCA regulations, EMTs are classified as stablecoins, but not all stablecoins are EMTs. EMTs are pegged to a single fiat currency and must be issued by authorized credit institutions or electronic money institutions, with holders having legal claims to them and the right to redeem them at face value at any time, and EMTs cannot pay interest.Qivalis CEO Jan-Oliver Sell stated that the currency in Europe should be carried on-chain by European rules, and Europe should have Euro-denominated on-chain settlement assets issued under European law and subject to European regulatory standards.

first_img Samsung Electronics plans three models of zNAND, aimed at customized AI storage

According to a report by ZDNet Korea on October 12, Samsung Electronics is expanding the application range of the next-generation NAND flash memory zNAND and plans to subdivide the products into three types: zNAND-O, zNAND-T, and zNAND-I, in addition to the publicly announced zNAND-O. The report states that Samsung Electronics has not officially announced the latter two products, but the industry has learned that related plans have entered the early development stage to address the increasing demand for customized storage in AI infrastructure.zNAND-O is aimed at edge AI. Unlike traditional wire bonding, this solution vertically stacks NAND in 4 or 8 layers through silicon vias, shortening the data transmission path and enhancing speed and energy efficiency. Samsung Electronics first publicly showcased the zNAND-O model at a memory-related event in the United States in August this year.zNAND-T focuses on throughput and is aimed at high-capacity, high-performance AI data centers, also expanding bandwidth through vertical stacking and silicon vias, and is referred to by the industry as high-bandwidth flash memory. zNAND-I focuses on increasing input/output operations per second, used for frequent processing of small-capacity temporary data such as key-value caches in AI inference. The report also mentions that SK Hynix is developing AI NAND product series such as AIN P, AIN D, and AIN B.

first_img Samsung Electronics executive: It is expected that HBM will account for nearly 30% of DRAM wafer production capacity next year

According to a report by the Financial Associated Press citing local media on September 29, Samsung Electronics Executive Vice President Kim Taewoo stated that HBM is expected to account for nearly 30% of the total wafer capacity of DRAM manufacturers next year, up from the current ratio of about 20%. He mentioned that HBM competes with traditional DRAM for the same batch of wafer capacity, and increasing HBM output may squeeze the supply of traditional DRAM.TrendForce previously predicted that by the end of 2027, the HBM wafer input from the three major global HBM suppliers will account for about 30% of the total DRAM wafer input, but in terms of storage capacity, it will only contribute about 13% of the total DRAM supply. Additionally, according to media reports on September 20, Samsung began mass production and shipment of HBM4 in February this year and provided 12-layer HBM4E samples to customers including NVIDIA in May; the industry expects Samsung's monthly wafer input for HBM to increase from about 180,000 wafers this year to about 250,000 wafers next year.On the same day, TrendForce stated that the demand for AI servers continues, and HBM and general DRAM will still share limited advanced process capacity. The storage supply will remain tight in 2027, and the price expectations for HBM in 2027 have been raised, with an expected year-on-year increase of 121% in the mixed average selling price. Due to limited supply and rising system costs, 8-layer HBM is expected to become a priority evaluation option for several manufacturers in 2027, with its price per Gb expected to be about 10% to 20% higher than that of 12-layer products.
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