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first_img TSMC's 1.4 nanometer factory in the Central Science Park is accelerating fully, with mass production expected in the second half of next year

The Central Science Management Bureau confirmed on the 9th that TSMC's Central Science Phase II 1.4 nanometer factory expansion is fully accelerating. The first P1 factory has completed its steel structure and is expected to begin trial production in April next year, with mass production anticipated in the second half of next year, ahead of the originally scheduled mass production in 2028. TSMC has applied to the Central Science Management Bureau to set up two temporary offices at the site, which are expected to be completed in April next year, with the first batch of over 5,400 operational and outsourced personnel moving in.The advanced process new factory for TSMC's Central Science Phase II park broke ground last October, planning to build four 1.4 nanometer factories, with nearly 2,000 workers working day and night. The P1 factory is currently undergoing floor and exterior wall construction, with the factory building expected to be completed early next year. The P2 factory has begun basic construction and is scheduled to be completed in October next year, with both factories expected to start mass production successively next year. The P3 factory has obtained a construction permit, while the P4 factory is in the process of applying for a construction permit, planning to be built with a six-month gap. P3 is expected to be completed in the second quarter of 2028, and P4 is scheduled for completion in the fourth quarter of the same year. After the P2 factory is completed in the second half of next year, an additional 1,000 operational personnel will be added, with the total number of employees expected to be between 9,000 and 10,000 when all four new factories in Phase II are completed and put into production.

first_img Samsung Taylor Semiconductor Fabrication Plant will begin trial operations at the end of this month, with 2-nanometer orders already filled

According to South Korea's "Cultural Daily," Samsung Electronics' wafer fab in Taylor, Texas, is expected to enter trial operation around the end of this month, as orders for 2-nanometer chips from Tesla, Broadcom, Arm, and others continue to pour in, with pre-production capacity nearing full load. The plant has accumulated an investment of $37 billion since 2022, with plans to begin trial operation early next month and mass production next year, with an initial monthly capacity of about 50,000 wafers, close to TSMC's approximately 80,000 wafers.The report states that the Taylor plant will produce Tesla's next-generation artificial intelligence chip AI5, Broadcom's new generation communication chips, and Arm's smart device AI chips, among others. Samsung's 2-nanometer yield has increased from about 60% earlier this year to around 80% recently. The company sent personnel for process, equipment, and yield to the plant in June, and began installing equipment in July. At a recent earnings meeting, Samsung projected that this year's 2-nanometer order volume would more than double compared to last year, and stated that NVIDIA's inference chip Grok3 began mass production last month; Samsung also recently raised the foundry price for 4-nanometer chips by up to 15%.The second Taylor plant is scheduled to start construction by the end of this year and begin mass production in 2030. Samsung has requested major partners to complete the relevant production equipment safety certifications in advance, and some partners are considering sending dozens of personnel to the local area. At the same time, Intel issued about $20 billion in new shares last month and expanded investments in 2-nanometer level 18A and 1.4-nanometer level 14A, while Japan's Rapidus completed its 2-nanometer factory in Hokkaido last month and entered the wafer trial production stage.

first_img Samsung's 4-nanometer production capacity is more than half used for HBM4 substrate chips

Samsung Electronics' wafer foundry division has recently surpassed 50% in the allocation of production capacity for the sixth-generation high bandwidth memory HBM4 substrate chips in the 4-nanometer process. The industry states that this division will invest more than half of its 4-nanometer wafers into HBM4 substrate chip manufacturing in the second half of this year to expand supply to companies like NVIDIA, Broadcom, and AMD.Samsung initiated mass production and shipment of HBM4 in February this year and plans to increase supply starting from the third quarter, significantly increasing the related wafer input since mid-year. This chip is based on Samsung's wafer foundry 4-nanometer (SF4) process. As of last month, over 50% of its total 4-nanometer capacity has been allocated to HBM4 substrate chips. According to insiders, Samsung's 4-nanometer process is currently at full capacity, with HBM4 substrate chips accounting for about 50% to 60%, and this high proportion will be maintained in the second half of the year.Samsung's wafer foundry production lines at Pyeongtaek Plant 2 and Plant 3 are mass-producing processes ranging from 4 to 7 nanometers, with a monthly capacity of about 30,000 wafers for the 4-nanometer process. Based on this, the wafer input related to HBM4 substrate chips is estimated to be about 15,000 wafers per month. During the second quarter earnings call, Samsung stated that it expects HBM4 revenue to increase more than threefold quarter-over-quarter in the third quarter, with HBM4 revenue in the second half expected to exceed 60% of the company's overall HBM revenue.

first_img Apple M6 uses TSMC 2 nanometers, advanced packaging demand drives the Taiwan supply chain

Apple's first 2-nanometer M6 chip officially debuts, equipped with a 12-core CPU, 12-core GPU, and dual 16-core neural network engines, with unified memory bandwidth reaching up to 170GB per second, initially featured in the new Mac mini. This chip is manufactured by TSMC using a 2-nanometer process and is the first to adopt gate-all-around (GAA) nanosheet transistors, making it the world's first consumer-grade 2-nanometer chip.The supply chain is focused on the subsequent high-end M series packaging architecture. Based on the Fusion Architecture of the previous generation M5 Pro, M5 Max, and the four-die design of M5 Ultra, Apple chips have transitioned from a single large die to a modular design. Future M6 Pro, Max, or Ultra are expected to enhance advanced packaging requirements such as SoIC-MH and WMCM, increasing interconnect density with SoIC-MH and integrating logic, LPDDR memory, and high-speed I/O with WMCM.TSMC is actively preparing for expansion, with Zhunan AP6 as the main mass production base for SoIC, Longtan AP3 upgrading to WMCM, and Chiayi AP7 taking on related capacity. Analysts estimate that WMCM's monthly production capacity will reach about 60,000 units by the end of 2026 and over 120,000 units in 2027. Equipment manufacturers such as Hongshuo, Junhua, Yinneng, and material manufacturers Changxing, Xinying Materials, and Yongguang are expected to benefit.

TSMC's net profit in the second quarter surged by 77.4%, exceeding expectations, with the 2-nanometer process contributing to revenue for the first time

Global chip foundry giant TSMC announced its financial report for the second quarter of 2026. Benefiting from the strong demand for advanced process chips driven by global AI infrastructure development, TSMC's performance this quarter significantly exceeded market expectations. During the period, it achieved revenue of NT$1.27 trillion (approximately US$40.2 billion), a year-on-year increase of 36%; net profit reached NT$706.6 billion (approximately US$22 billion), a year-on-year surge of 77.4%, far exceeding the market's previous estimate of NT$623.7 billion. In addition, the company's gross margin for the quarter reached 67.7%, and the operating margin was 60.3%, both better than expected.In terms of process structure, advanced processes (7 nanometers and below) contributed a total of 77% to the total wafer revenue this quarter. Among them, the 3-nanometer and 5-nanometer processes accounted for 30% and 33%, respectively, while the 7-nanometer process accounted for 11%. Notably, TSMC's newly shipped 2-nanometer advanced process recorded revenue for the first time, accounting for 3%.Looking ahead, TSMC confirmed that its capital expenditure for 2026 will approach a record US$56 billion and plans to invest approximately US$26.5 billion in its advanced manufacturing park in Arizona, USA. TSMC CEO C.C. Wei stated that the current pace of capacity expansion still lags behind demand, and the situation of supply not meeting demand is expected to continue for several years. Meanwhile, despite TSMC's strong performance, the market remains somewhat cautious and concerned about whether the massive AI investments by tech giants can translate into actual returns and the medium- to long-term competitive landscape.

Anome collaborates with CyberCharge to build a Web3 super ecosystem of "virtual and real integration, digital and physical symbiosis."

ChainCatcher message, two major projects supported by top consortiums, Anome and CyberCharge, are jointly building a "virtual-real integration, digital-physical symbiosis" Web3 super ecosystem.Core Highlights:Anome: Positioned as a "game × asset × growth" operating system, integrating multi-asset settlement and low-threshold experience, will launch from Binance Alpha and simultaneously land on multiple exchanges.CyberCharge: A connector between the real world and the Web3 world, creating an asset entry for high-frequency daily behaviors through the "Charge-to-Earn model" and gamified operations. It has already established a node in Ho Chi Minh City and will expand to locations such as Singapore and Tokyo.Anome and CyberCharge rely on the "Trendy Play Universe" IP content engine and the "Swarm Alliance" task distribution network to open up an efficient traffic channel from Web2 to Web3. The "incubation fund" established by the consortium participates in the deep co-construction of projects through a multi-layered support system, growth companionship mechanism, and ecological interconnection among projects, combining "capital + industry + content."The project aims to create a low-threshold, high-viscosity user entry through the "high-frequency behavior + gamified assets" model, accelerating the migration of Web2 users to Web3.
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